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LOCTITE® ABLESTIK 813J01 BIPAX

Henkel
LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is non-corrosive and will not revert when exposed to high temperatures.
  • Excellent thermal conductivity
  • Bonds well to difficult substrates
  • Low stress
Verfügbarkeit: auf Anfrage
Persönliches Angebot
LOCTITE ABLESTIK 813J01 BIPAX, Silikon, nicht-korrosiv, Vergussmasse

Sicherheitsdatenblätter (SDB) auf Anfrage

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LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is non-corrosive and will not revert when exposed to high temperatures.
Verpackungsart Andere Verpackungsarten
Weitere Informationen
BMC interner Schlüsselcode 1437389
regionale Verfügbarkeit auf Anfrage
Marke LOCTITE®