LOCTITE® ECCOBOND LA 3032-78
Henkel
LOCTITE® ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics
- One component
- Fast cure at low temperatures
- Excellent chemical resistance
Verfügbarkeit: auf Anfrage
LOCTITE ECCOBOND LA 3032-78, Chemisch beständig, Epoxid, Vergussmasse
Sicherheitsdatenblätter (SDB) auf Anfrage
