LOCTITE® ECCOBOND UF 3808, 50 ml Barrel/drum
Henkel
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
- High Tg
- Reworkable
- Low CTE
- Room temperature flow capability
Verfügbarkeit: auf Anfrage
LOCTITE ECCOBOND UF 3808, Epoxidharz, Underfill
Sicherheitsdatenblätter (SDB) auf Anfrage
