BERGQUIST HI FLOW THF 700UT

TYPICAL APPLICATIONS ● Computer and peripherals ● High performance computer processors ● Graphic cards ● Power modules BERGQUIST HI FLOW THF 700UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. BERGQUIST HI FLOW THF 700UT is a thermally conductive 55°C phase change composite with inherent tack. The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs. Above its phase change temperature, BERGQUIST HI FLOW THF 700UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow. BERGQUIST HI FLOW THF 700UT coatings will resist dripping.