GAP-FILLER TGF 4000
Henkel
BERGQUIST GAP FILLER TGF 4000 is a two-part, high
thermal conductivity, liquid gap filling material. The mixed
system will cure at room temperature and can be accelerated
with the addition of heat. BERGQUIST GAP FILLER TGF 4000
offers an extended working time to allow greater flexibility in
the customer’s assembly process.
Liquid dispensed thermal materials offer infinite thickness
variations and impart little to no stress on sensitive
components during assembly. BERGQUIST GAP FILLER
TGF 4000 exhibits low level natural tack characteristics and is
intended for use in applications where a strong structural bond
is not required.
As cured, BERGQUIST GAP FILLER TGF 4000 provides a
soft, thermally conductive, form-in place elastomer that is ideal
for fragile assemblies and filling unique and intricate air voids
and gaps.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Computer and peripherals
● Between any heat-generating semiconductor and a heat
sink
● Telecommunications
- Liquid thermal Conductive Gap Filler
- 4 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 50'000 Mpa's
- Blue Color
Disponibilité: sur demande
Versatile, high-performance dispensable liquid, Extended working time for manufacturing flexibility, Ultra-conforming, with excellent wet-out, 100% solids - no cure by-products, Excellent low and high temperature mechanical and chemical stability
Fiche de données de sécurité (FDS) sur demande
