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LOCTITE® 3607, 300 ml Container

Henkel
LOCTITE® 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive.
    Disponibilité: sur demande
    LOCTITE 3607, epoxy

    Fiche de données de sécurité (FDS) sur demande

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    LOCTITE® 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive.
    Type d'emballage Conteneur
    Plus d'infos
    Clé interne BMC 88135
    Regional availability sur demande
    Marques LOCTITE