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LOCTITE® ABLESTIK A 312

Henkel
LOCTITE® ABLESTIK A 312 epoxy underfill is designed for use as a capillary flow for CSP and BGA packages in integrated circuit applications.
    Availability: on demand
    Personal consultation
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK A 312 epoxy underfill is designed for use as a capillary flow for CSP and BGA packages in integrated circuit applications.
    Packaging type Other types of packaging
    More Information
    BMC internal key 1189258
    Regional availability on demand
    Brands LOCTITE®

    LOCTITE® ABLESTIK A 312

    Personal consultation