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LOCTITE® ECCOBOND DAM 7010C

Henkel
LOCTITE® ECCOBOND DAM 7010C is formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
  • Crack and thermal resistant
  • Good chemical resistance
  • Low thermal expansion
  • High purity
Availability: on demand
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LOCTITE ECCOBOND DAM 7010C, dam encapsulant
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND DAM 7010C is formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 2648781
Colour Black
Regional availability on demand
Brands LOCTITE®