BERGQUIST GAP-FILLER 1000SR
Henkel
BERGQUIST GAP FILLER TGF 1000SR is a two-part,
thermally conductive, liquid gap filling material that features
superior slump resistance. The mixed system will cure at room
temperature and can be accelerated with the addition of heat.
Unlike cured thermal pad materials, a liquid approach offers
infinite thickness variations with little or no stress to sensitive
components during assembly. As cured, BERGQUIST GAP
FILLER TGF 1000SR will provide a soft, thermally conductive,
form-in place elastomer that is ideal for fragile assemblies,
capable of filling unique and intricate air voids and gaps.
BERGQUIST GAP FILLER TGF 1000SR exhibits low level
natural tack characteristics and is intended for use in
applications where a strong structural bond is not required.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Computer and peripherals
● Between heat-generating semiconductors or magnetic
components and a heat si
- Liquid thermal Conductive Gap Filler
- 1 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 20'000 Mpa's
- Violet Color
Availability: on demand
Excellent slump resistance (stays in place) Excellent low and high temperature mechanical andchemical stability Ultra-conforming, with excellent wet-out for low stress interface applications
Safety Data Sheet (SDS) on request
