BERGQUIST GAP-FILLER 1500
Henkel
BERGQUIST GAP FILLER TGF 1500 is a two-part, high
performance, thermally conductive liquid gap filling material,
which features superior slump resistance and high shear
thinning characteristics for optimized consistency and control
during dispensing. The mixed system will cure at room
temperature and can be accelerated with the addition of heat.
Unlike cured thermal pad materials, a liquid approach offers
infinite thickness variations with little or no stress to the
sensitive components during assembly. BERGQUIST GAP
FILLER TGF 1500 exhibits low level natural tack
characteristics and is intended for use in applications where a
strong structural bond is not required.
As cured, BERGQUIST GAP FILLER TGF 1500 provides a
soft, thermally conductive, form-in place elastomer that is ideal
for fragile assemblies and filling unique and intricate air voids
and gaps.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Telecommunications
● Computer and peripherals
● Betwee
- Liquid thermal Conductive Gap Filler
- 1.8 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 25'000 Mpa's
- Yellow Color
Availability: on demand
Versatile, cost-effective dispensable liquid
Safety Data Sheet (SDS) on request
