BERGQUIST GAP-FILLER 1500LVO
Henkel
BERGQUIST GAP FILLER TGF 1500LVO is a thermally
conductive, liquid gap filling material. This material offers the
high temperature resistance and low modulus of a silicone
material with significantly lower levels of silicone outgassing for
use in silicone sensitive application.
The mixed system will cure at room temperature and can be
accelerated with the addition of heat. As cured BERGQUIST
GAP FILLER TGF 1500LVO provides a soft, thermally
conductive, form-in place elastomer that is ideal for fragile
assemblies and filling unique and intricate air voids and gaps.
Liquid dispensed thermal materials offer infinite thickness
variations and impart little to no stress on sensitive
components during assembly. BERGQUIST GAP FILLER
TGF 1500LVO exhibits low level natural tack characteristics
and is intended for use in applications where a strong structural
bond is not required.
TYPICAL APPLICATIONS
● Lighting
● Automotive electronics (HEV, NEV, batteries)
● Silicone-sensitive electronics
- Liquid thermal Conductive Gap Filler
- 1.8 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 20'000 Mpa's
- Yellow Color
Availability: on demand
Ultra-conforming, with excellent wet-out 100% solids — no cure by-products
Safety Data Sheet (SDS) on request
