BERGQUIST GAP PAD TGP 1100SF
Henkel
Thermal Conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 203 406.00
sheet 0.25 203 406.00
sheet 0.38 203 406.00
sheet 0.51 203 406.00
sheet 1.02 203 406.00
sheet 2.03 203 406.00
sheet 2.54 203 406.00
sheet 3.18 203 406.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal conductivity: 0.9 W/m-K
- Silicone free
- Room temperature as well as accelerated curing possible
- UL94 V-1 compliance
Availability: on demand
BERGQUIST GAP PAD TGP 1100SF is a silione-free (SF) thermally conductive gap pad which also offers electrical isolation.
Safety Data Sheet (SDS) on request
