BERGQUIST GAP PAD TGP 12000
Henkel
TGP 12000 is a soft gap filling material rated at a thermal conductivity of 12 W/m-K. It is specially formulated for high performance applications requiring low assembly stress
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 203 203.00
sheet 1.02 203 203.00
sheet 2.03 203 203.00
sheet 2.54 203 203.00
sheet 3.18 203 203.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal conductivity of 12 W/m-K.
- Highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface
- Low compression stress
Availability: on demand
BERGQUIST GAP PAD TGP 12000 is a soft gap filling material rated at a thermal conductivity of 12 W/m-K. It is specially formulated for high performance applications requiring low assembly stress.
Safety Data Sheet (SDS) on request
