BERGQUIST GAP PAD TGP 2000
Henkel
Thermal Conductivity: 2.0 W/m-K
Low “S-Class” thermal resistance at very low pressures
Designed for low-stress applications
Highly Conformable, low hardness
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 0.51 203 406.00
sheet 0.76 203 406.00
sheet 1.02 203 406.00
sheet 1.27 203 406.00
sheet 1.52 203 406.00
sheet 2.03 203 406.00
sheet 2.54 203 406.00
sheet 3.18 203 406.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Designed for low-stress applications
- Highly Conformable, low hardness
Availability: on demand
BERGQUIST GAP PAD TGP 2000 is a silicone based, highly conformable, thermally conductive, reinforced “S-Class” gap filling material.
Safety Data Sheet (SDS) on request
