BERGQUIST GAP PAD TGP 2000SF
Henkel
High Thermal Conductivity: 2 W/m-K
Natural inherent tack reduces interfacial thermal resistance and aids assembly
Fiberglass reinforced for puncture, shear and tear resistance
Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads, TO-220 Performance
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 203 406.00
sheet 0.25 203 406.00
sheet 0.38 203 406.00
sheet 0.51 203 406.00
sheet 1.02 203 406.00
sheet 2.03 203 406.00
sheet 2.54 203 406.00
sheet 3.18 203 406.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- High Thermal Conductivity: 2 W/m-K
- Natural inherent tack reduces interfacial thermal resistance and aids assembly
- Fiberglass reinforced for puncture, shear and tear resistance
- Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads
Availability: on demand
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
Safety Data Sheet (SDS) on request
