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BERGQUIST GAP PAD TGP 2101SF

Henkel
The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive application, Tack on one side for easy handling The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly. This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
  • Thermal Conductivity: 2.0 W/m-K
  • No silicone outgassing
  • No silicone extraction
  • Tack on one side for easy handling
Availability: on demand
Personal consultation
BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material
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Safety Data Sheet (SDS) on request

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The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive application, Tack on one side for easy handling The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly. This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
More Information
BMC internal key BERGQUIST GAP PAD TGP 2101SF
Regional availability on demand
Brands BERGQUIST®