BERGQUIST GAP PAD TGP 2200SF
Henkel
material that is ideal for applications with uneven topologies and high stackup tolerances, SF Silicon Free
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 203 406.00
sheet 0.25 203 406.00
sheet 0.38 203 406.00
sheet 0.51 203 406.00
sheet 1.02 203 406.00
sheet 2.03 203 406.00
sheet 2.54 203 406.00
sheet 3.18 203 406.00
Fiberglassinforced with natural tack on both sides
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermally conductive 2.0 W/m-K
- Silicone-free formulation
- Medium compliance with easy handling
- Electrically isolating
Availability: on demand
BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
Safety Data Sheet (SDS) on request
