BERGQUIST GAP PAD TGP 2202SF
Henkel
0.5 mil PET film, Thermal Conductivity: 2.0 W/m-K
Silicone-free formulation
Minimal compression set
0.5 mil film provides tack-free surface
Tacky side allows for ease of handling and placement
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 229 457.00
sheet 0.25 229 457.00
sheet 0.51 229 457.00
sheet 0.76 229 457.00
sheet 1.02 229 457.00
sheet 1.14 229 457.00
sheet 2.03 229 457.00
sheet 2.54 229 457.00
sheet 3.18 229 457.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal Conductivity: 2.0 W/m-K
- Silicone-free formulation
- 0.5 mil film provides tack-free surface
- Minimal compression set
Availability: on demand
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
Safety Data Sheet (SDS) on request
