BERGQUIST GAP PAD TGP HC1000
Henkel
The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 0.25 203 406.00
sheet 0.38 203 406.00
sheet 0.51 203 406.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal Conductivity: 1.0 W/m-K
- “Gel-like” modulus
- Fiberglass reinforced for puncture, shear and tear resistance
- Highly Conformable, low hardness
Availability: on demand
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material
Safety Data Sheet (SDS) on request
