BERGQUIST LIQUI FORM TLF 4500CGEL-SF
Henkel
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF is a one part,high
performance, thermally conductivity, silicone-free, room temperature
curable gel designed for demanding high reliability applications.
Curing (skin formation) can be accelerated with heat. As cured,
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF provides a soft,
thermally conductive, form-in place elastomer that is ideal for fragile
assemblies, capable of filling unique and intricate air voids and gaps.
It is ideal for applications where highly reliable vertical gap stability is
required. BERGQUIST® LIQUI FORM TLF 4500CGEL-SF requires
no mixing or refrigerated storage. This material's unique silicone-free
formulation assures a balanced mix of high thermal conductivity,
good dispensing efficiency and high performance reliability.
Typical applications
Automotive electronics (ADAS, EV, ECU)
Telecommunications
Devices requiring low assembly pressure
Computer peripherals
Between heat-generating semi conductors and a heat sink
Features and benefits
Thermal Conductivity: 4.5 W/m-K
1K curable application gel for enhanced processing and
excellent temperature, mechanical, and chemical stability
Silicone-free formulation
Optimized shear thinning rheology for enhanced 1K dispense
rate
Excellent form stability (stays in place)
Ultra-conforming, with excellent wet-out and low assembly
stress
Suitable for low stress interface applications
- Liquid thermal Conductive Gap Filler
- 4.5 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 45 Pa's
- Grey Paste Color
Availability: on demand
Innovative 1-component solution that cures in place for enhanced vertical gap stability* Excellent handling properties & very fast dispensing speed Silicone-free technology passing hazing and fogging tests optimized for optical systems High thermal conduc
Safety Data Sheet (SDS) on request
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