BERGQUIST LIQUI FORM TLF 4500CGEL-SF

BERGQUIST® LIQUI FORM TLF 4500CGEL-SF is a one part,high performance, thermally conductivity, silicone-free, room temperature curable gel designed for demanding high reliability applications. Curing (skin formation) can be accelerated with heat. As cured, BERGQUIST® LIQUI FORM TLF 4500CGEL-SF provides a soft, thermally conductive, form-in place elastomer that is ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It is ideal for applications where highly reliable vertical gap stability is required. BERGQUIST® LIQUI FORM TLF 4500CGEL-SF requires no mixing or refrigerated storage. This material's unique silicone-free formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high performance reliability. Typical applications Automotive electronics (ADAS, EV, ECU) Telecommunications Devices requiring low assembly pressure Computer peripherals Between heat-generating semi conductors and a heat sink Features and benefits Thermal Conductivity: 4.5 W/m-K 1K curable application gel for enhanced processing and excellent temperature, mechanical, and chemical stability Silicone-free formulation Optimized shear thinning rheology for enhanced 1K dispense rate Excellent form stability (stays in place) Ultra-conforming, with excellent wet-out and low assembly stress Suitable for low stress interface applications