BERGQUIST TGR 4000
Henkel
BERGQUIST TGR 4000 is a thermally conductive grease
compound designed for use as a thermal interface material
between a computer processor and a copper-based heat sink.
Other high watt density applications will benefit from the
extremely low thermal impedance of BERGQUIST TGR 4000.
The BERGQUIST TGR 4000 compound wets-out the thermal
interface surfaces and flows to produce the lowest thermal
impedance. The compound requires pressure of the assembly
to cause flow. BERGQUIST TGR 4000 compound will not drip.
For a typical 0.5'' x 0.5'' application at 0.005'' thick, Bergquist
estimates approximately 0.02 ml (cc) of BERGQUIST TGR
4000.
Although Bergquist estimates a 0.02 ml (cc) volumetric
requirement for a 0.5'' x 0.5'' component interface, dispensed
at a thickness of 0.005'', Bergquist also recognizes that an
optimized application would utilize the minimum volume of
BERGQUIST TGR 4000 material necessary to ensure
complete wet-out of both mechanical interfaces.
TYPICAL APPLICATIONS
● High performance computer processors (traditional screw
fastening or clamping methods will provide adequate
force to optimize the thermal performance of BERGQUIST
TGR 4000)
● High watt density applications where the lowest thermal
resistance interface is required
- Liquid thermal Conductive Gap Filler
- 4 THERMAL CONDUCTIVITY (W/m-K)
- Paste
- Grey Color
Availability: on demand
20g Package, High thermal conductivity: 4.0 W/m-K Exceptional thermal performance: 0.19°C/W at 50 psi Designed for use with copper heat sinks
Safety Data Sheet (SDS) on request
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