LOCTITE® 3517, 30 ml Syringe
Henkel
LOCTITE® 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
Availability: on demand
Safety Data Sheet (SDS) on request
