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LOCTITE® 3517, 30 ml Syringe

Henkel
LOCTITE® 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    LOCTITE® 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
    Packaging type Syringe
    More Information
    BMC internal key 839286
    Regional availability on demand
    Brands LOCTITE®