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LOCTITE® 3563, 30 ml Syringe

Henkel
LOCTITE® 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.
  • One component - requires no mixing
  • Fast flowing epoxy liquid
  • Production - high speed curing
Availability: on demand
Personal consultation
LOCTITE 3563, Epoxy, One Component
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Syringe
Physical appereance Liquid
More Information
BMC internal key 1236079
Colour brown
Regional availability on demand
Brands LOCTITE®