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Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

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LOCTITE® 3607, 300 ml Container

Henkel
LOCTITE® 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive.
    Availability: on demand
    Personal consultation
    LOCTITE 3607, epoxy
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    Safety Data Sheet (SDS) on request

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    LOCTITE® 3607 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. The very low moisture absorption allows longer exposure to humidity in open baths without affecting dispensability or causing void formation in the cured adhesive.
    Packaging type Container
    More Information
    BMC internal key 88135
    Regional availability on demand
    Brands LOCTITE®