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LOCTITE® 3619, 30 ml Barrel/drum

Henkel
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
  • One component
  • High dispense speed
  • High wet strength
Availability: on demand
Personal consultation
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Barrel
Physical appereance Paste
More Information
BMC internal key 1099560
Colour Red
Regional availability on demand
Brands LOCTITE®