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LOCTITE® 3621, 30 ml

Henkel
LOCTITE® 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
  • One component - requires no mixing
  • Very high dispense speed
  • High wet strength
Availability: on demand
Personal consultation
LOCTITE 3621, Epoxy, Surface mount adhesive

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Other types of packaging
Physical appereance Gel
More Information
Colour Red
Regional availability on demand
Brands LOCTITE®