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LOCTITE® ABLESTIK 2025D, 14 g

Henkel
LOCTITE® ABLESTIK 2025D is a non-conductive, heat curing, die attach adhesive that exhibits minimal bleed and good adhesion to many different substrates. With excellent hot/wet die shear strength and 260°C reflow capability for Pb-free applications, this product is typically used in PBGA, FlexBGA, and Stacking BGA package applications.
  • Good adhesion to a variety of substrates
  • High hot/wet die shear strength
  • Minimum bleed
  • 260°C reflow capability for Pb-free applications
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 2025D is a red, proprietary hybrid chemistry die attach adhesive designed for use in array packaging.
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 2025D is a non-conductive, heat curing, die attach adhesive that exhibits minimal bleed and good adhesion to many different substrates. With excellent hot/wet die shear strength and 260°C reflow capability for Pb-free applications, this product is typically used in PBGA, FlexBGA, and Stacking BGA package applications.
Chemical Base Hybrid Chemistry
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1466110
Colour Red
Regional availability on demand
Brands LOCTITE®