LOCTITE® ABLESTIK 2025D, Standard cartridge
LOCTITE® ABLESTIK 2025D is a non-conductive, heat curing, die attach adhesive that exhibits minimal bleed and good adhesion to many different substrates. With excellent hot/wet die shear strength and 260°C reflow capability for Pb-free applications, this product is typically used in PBGA, FlexBGA, and Stacking BGA package applications.
- Good adhesion to a variety of substrates
- High hot/wet die shear strength
- Minimum bleed
- 260°C reflow capability for Pb-free applications
Availability: on demand
LOCTITE ABLESTIK 2025D is a red, proprietary hybrid chemistry die attach adhesive designed for use in array packaging.
Safety Data Sheet (SDS) on request