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Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

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LOCTITE® ABLESTIK 2033SC, 13 g

Henkel
LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
  • Non-conductive
  • Single component
  • Long work life
  • Low bleed
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
Packaging type Other types of packaging
More Information
BMC internal key 1466051
Regional availability on demand
Brands LOCTITE®