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LOCTITE® ABLESTIK 2035SC

Henkel
LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
  • Non-conductive
  • Single component
  • Fast cure
  • Low cure temperature
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
Chemical Base Hybrid Chemistry
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1201472
Colour Red
Regional availability on demand
Brands LOCTITE®