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LOCTITE® ABLESTIK 2100A

Henkel
LOCTITE® ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
  • High hot/wet adhesion
  • Ultra-low moisture absorption
  • Low stress
  • Pb-free applications
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 2100A, Proprietary Hybrid Chemistry, Die Attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
Packaging type Other types of packaging
More Information
BMC internal key 1203323
Regional availability on demand
Brands LOCTITE®