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LOCTITE® ABLESTIK 2112 BIPAX

Henkel
LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.
  • Two component
  • Thixotropic
  • Non-sag
  • Solvent-free
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.
Packaging type Other types of packaging
More Information
BMC internal key 1401756
Regional availability on demand
Brands LOCTITE®