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LOCTITE® ABLESTIK 550K

Henkel
LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
  • Low cure temperature
  • High thermal conductivity
  • Suitable for an array of difficult-to-bond substrates
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
Packaging type Other types of packaging
More Information
BMC internal key 1200012
Regional availability on demand
Brands LOCTITE®