LOCTITE® ABLESTIK 550K
Henkel
LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
- Low cure temperature
- High thermal conductivity
- Suitable for an array of difficult-to-bond substrates
Availability: on demand
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly
Safety Data Sheet (SDS) on request
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