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LOCTITE® ABLESTIK 8-2

Henkel
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
  • One component - requires no mixing
  • Positive under UV light
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
Packaging type Other types of packaging
More Information
BMC internal key 1188401
Regional availability on demand
Brands LOCTITE®