LOCTITE® ABLESTIK 8008MD, 5 cc
Henkel
LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
- Electrically conductive
- Thermally conductive
- Low modulus
- Good substrate wetting
Availability: on demand
LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach
Safety Data Sheet (SDS) on request
