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LOCTITE® ABLESTIK 8008MD, 5 cc

Henkel
LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
  • Electrically conductive
  • Thermally conductive
  • Low modulus
  • Good substrate wetting
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
Packaging type Other types of packaging
More Information
BMC internal key 1409337
Regional availability on demand
Brands LOCTITE®