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LOCTITE® ABLESTIK 8008NC, Can

Henkel
This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. LOCTITE® ABLESTIK 8008NC should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes. Suitable die sizes are 3 x 3mm.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. LOCTITE® ABLESTIK 8008NC should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes. Suitable die sizes are 3 x 3mm.
    Packaging type Can
    More Information
    BMC internal key 1239173
    Regional availability on demand
    Brands LOCTITE®