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LOCTITE® ABLESTIK 8175

Henkel
LOCTITE® ABLESTIK 8175 is an electrically and thermally conductive material that is a Pb-free alternative to solder. The stress absorbing material is heat curable and may be used with thick metallizations or traditional printed circuit board surfaces and is stencil or screen printable. This product meets MIL-STD-883, Method 5011 requirements.
  • Electrically and thermally conductive
  • Stress absorbing
  • Pb-free alternative to solder
  • Stencil or screen printable
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 8175 is a silver, epoxy adhesive material that is a solder replacement in microelectronic interconnect applications.

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 8175 is an electrically and thermally conductive material that is a Pb-free alternative to solder. The stress absorbing material is heat curable and may be used with thick metallizations or traditional printed circuit board surfaces and is stencil or screen printable. This product meets MIL-STD-883, Method 5011 requirements.
Packaging type Other types of packaging
More Information
Regional availability on demand
Brands LOCTITE®