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LOCTITE® ABLESTIK 8175A

Henkel
LOCTITE® ABLESTIK 8175A is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a stainless steel mesh screen or a metal mask stencil.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK 8175A is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a stainless steel mesh screen or a metal mask stencil.
    Packaging type Other types of packaging
    More Information
    BMC internal key 1202900
    Regional availability on demand
    Brands LOCTITE®