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LOCTITE® ABLESTIK 8387B

Henkel
LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.
  • Black pigmentation for blocking stray light
  • Non-conductive
  • Fast cure
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1201266
Colour Black
Regional availability on demand
Brands LOCTITE®