LOCTITE® ABLESTIK 84-1LMI

Henkel

LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.

Electrically conductive
Low bleed
Low outgassing

Availability: on demand

LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.

Chemical Base	Epoxy
Number of Components	1_component_system
Curing Type	Heat cure
Packaging type	Other types of packaging

More Information
BMC internal key	1199666
Colour	Silver
Regional availability	on demand
Brands	LOCTITE®