close

Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

  • My Wish List 0
  • My Cart 0

This is only a sample image of the product.

LOCTITE® ABLESTIK 84-1LMI, Can

Henkel
LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.
  • Electrically conductive
  • Low bleed
  • Low outgassing
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach
Add to Wish List Add to Compare

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

/H/e/Henkel_4742.jpg
/l/o/loctite_logo_f5d5.JPG
LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Can
More Information
BMC internal key 1189946
Colour Silver
Regional availability on demand
Brands LOCTITE®