LOCTITE® ABLESTIK 84-1LMISR4
LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
- Box oven cure
- Excellent dispensability, minimal tailing and stringing
Availability: on demand
LOCTITE ABLESTIK 84-1LMISR4, Epoxy, Die attach
Safety Data Sheet (SDS) on request