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LOCTITE® ABLESTIK 84-1LMISR4

Henkel
LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
  • Conductive
  • Box oven cure
  • Excellent dispensability, minimal tailing and stringing
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 84-1LMISR4, Epoxy, Die attach
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1189958
Colour Silver
Regional availability on demand
Brands LOCTITE®