LOCTITE® ABLESTIK 933-1, Syringe
Henkel
LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
- Electrically Insulating
- One component
- Provides environmental and mechanical protection
Availability: on demand
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant
Safety Data Sheet (SDS) on request