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LOCTITE® ABLESTIK 965-1L

Henkel
LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
  • Electrically conductive
  • Stress absorbing
  • Low levels of contaminants
  • Void-free bondline with minimal bleed
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
Packaging type Other types of packaging
More Information
BMC internal key 1202316
Regional availability on demand
Brands LOCTITE®