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LOCTITE® ABLESTIK ABP 2024, Syringe

Henkel
LOCTITE® ABLESTIK ABP 2024 non-conductive paste is designed for image sensor die attach applications. It is formulated to have low outgassing at 260ºC and eliminate contamination in cavity package applications requiring reflow.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK ABP 2024 non-conductive paste is designed for image sensor die attach applications. It is formulated to have low outgassing at 260ºC and eliminate contamination in cavity package applications requiring reflow.
    Packaging type Syringe
    More Information
    BMC internal key 1695615
    Regional availability on demand
    Brands LOCTITE®