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Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

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LOCTITE® ABLESTIK ABP 8062T, Syringe

Henkel
LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
  • Hydrophobic
  • Thermally conductive
  • Electrically conductive
  • Stable at high temperatures
Availability: on demand
Personal consultation
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
Packaging type Syringe
More Information
BMC internal key 1639719
Regional availability on demand
Brands LOCTITE®