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LOCTITE® ABLESTIK ABP 8068TB, Syringe

Henkel
LOCTITE® ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. It is formulated with a more enhanced resin bleed control than its predecessor LOCTITE ABLESTIK ABP 8068TA. LOCTITE ABLESTIK ABP 8068TB is designed to provide high adhesion and low stress which are essential for the thermal and reliability performances of high end power packages. The thermal performance of this material is comparable to that of a solder paste product.
  • No resin bleed-out
  • One component
  • Good workability
  • Good sintering properties when used on Ag, PPF, Au and Cu substrates
Availability: on demand
Personal consultation
LOCTITE ABLESTIK ABP 8068TB, Silver-filled, Semi-sintering, Semiconductor, Conductive adhesive
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK ABP 8068TB is a silver-filled semi-sintering die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. It is formulated with a more enhanced resin bleed control than its predecessor LOCTITE ABLESTIK ABP 8068TA. LOCTITE ABLESTIK ABP 8068TB is designed to provide high adhesion and low stress which are essential for the thermal and reliability performances of high end power packages. The thermal performance of this material is comparable to that of a solder paste product.
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Syringe
Physical appereance Liquid
More Information
BMC internal key 2367772
Colour Silver
Regional availability on demand
Brands LOCTITE®