LOCTITE® ABLESTIK ABP 8068TD, Syringe

LOCTITE® ABLESTIK ABP 8068TD is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (BacksideMetallization). Thismaterial’sepoxy assisted sintering formulationisdesigned to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages such as SiP.