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LOCTITE® ABLESTIK ABP 8068TD, Syringe

Henkel
LOCTITE® ABLESTIK ABP 8068TD is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (BacksideMetallization). Thismaterial’sepoxy assisted sintering formulationisdesigned to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages such as SiP.
    Availability: on demand
    Personal consultation
    LOCTITE ABLESTIK ABP 8068TD, semi-sintering die attach adhesive, one component
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK ABP 8068TD is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (BacksideMetallization). Thismaterial’sepoxy assisted sintering formulationisdesigned to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages such as SiP.
    Packaging type Syringe
    More Information
    BMC internal key 2670363
    Regional availability on demand
    Brands LOCTITE®